Research on Online Monitoring Method for Bond Wire Fatigue Applied to IGBT Module
Hongtao Liu, Fei Wang, Weiyi Xia, Chaoyue Shen- Electrical and Electronic Engineering
- Computer Networks and Communications
- Hardware and Architecture
- Signal Processing
- Control and Systems Engineering
Bond wire fatigue is a prominent problem affecting the reliability of IGBT modules and power electronic converters, and has thus received much attention in the research community. As bond wire fatigue leads to changes in the gate circuit parameters, it affects the IGBT turn-off process. Based on this finding, this paper proposes a fatigue evaluation method for bond wire based on IGBT turn-off time. This includes constructing a turn-off time-bond wire fatigue model that considers the impact of changes in collector current, and developing a control software that utilizes the coupling relationship between the Kelvin terminal voltage VeE and turn-off time for the online extraction of IGBT turn-off time. In summary, the proposed online monitoring method of IGBT bond wire fatigue based on turn-off time can help improve the reliability of power electronic converters.